3-dimensional nor memory array with very fine pitch: device and method

ABSTRACT

A method to ease the fabrication of high aspect ratio three dimensional memory structures for memory cells with feature sizes of 20 nm or less, or with a high number of memory layers. The present invention also provides an improved isolation between adjacent memory cells along the same or opposite sides of an active strip. The improved isolation is provided by introducing a strong dielectric barrier film between adjacent memory cells along the same side of an active strip, and by staggering memory cells of opposite sides of the active strip.

CROSS REFERENCES TO RELATED APPLICATIONS

The present application is a continuation application of U.S. patentapplication Ser. No. 16/809,389, entitled “3-Dimensional NOR MemoryArray with Very Fine Pitch: Device and method,” filed on Mar. 4, 2020,which is a continuation application of U.S. patent application Ser. No.16/230,981, entitled “3-Dimensional NOR Memory Array with Very FinePitch: Device and method,” filed on Dec. 21, 2018, which is related toand claims priority of (i) U.S. provisional patent application(“Provisional Application I”), Ser. No. 62/611,205, entitled“3-Dimensional NOR Memory Array with Very Fine Pitch: Device and method,filed on Dec. 28, 2017 (ii) U.S. provisional patent application(“Provisional Application II”), Ser. No. 62/752,092, entitled“3-Dimensional NOR Memory Array with Very Fine Pitch: Device and method,filed on Oct. 29, 2018. The disclosures of Provisional Applications Iand II (collective, the “Non-Provisional applications”) are herebyincorporated by reference in their entirety.

The present application is also related to (i) U.S. patent application(“Non-Provisional application I”), Ser. No. 16/107,118, entitled“Capacitive-Coupled Non-Volatile Thin-film Transistor Strings inThree-Dimensional Arrays,” filed Aug. 21, 2018; (ii) U.S. patentapplication (“Non-Provisional application II”), Ser. No. 16/107,732,entitled “Three-dimensional Vertical NOR Flash Thin-Film TransistorStrings,” filed on Aug. 21, 2018; (iii) U.S. patent application(“Non-provisional application III”), Ser. No. 16/012,731, entitled“3-Dimensional NOR Memory Array Architecture and Methods for FabricationThereof,” filed Aug. 19, 2018, which claims priority of U.S. provisionalpatent applications, Ser. Nos. 62/552,661, 62/522,665, 62,622/666, and62/550,553; (iv) U.S. patent application (“Non-provisional applicationIV”), Ser. No. 16/113,296, entitled “Staggered Word Line Architecturefor Reduced Disturb in 3-Dimensional NOR Memory Arrays,” filed on Aug.27, 2018, which claims priority of U.S. provisional application, Ser.No. 62/551,110; (v) U.S. patent application (“Non-provisionalapplication V”), Ser. No. 16/006,573, entitled “3-Dimensional NOR StringArrays in Segmented Stacks,” filed on Jun. 12, 2018, which claimspriority of U.S. provisional patent application, Ser. No. 62/522,661,filed on Jun. 20, 2017; (vi) U.S. patent application (“Non-provisionalapplication VI”), Ser. No. 16/006,612, entitled “3-Dimensional NORString Arrays in Segmented Shared Store Regions,” filed on Jun. 12,2018, which claims priority of U.S. provisional patent application, Ser.No. 62/522,665, filed on Jun. 20, 2017. The disclosures ofNon-Provisional applications I-VI (collectively, the “Non-Provisionalapplications”) are hereby incorporated by reference in their entireties.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to non-volatile NOR-type memory strings.In particular, the present invention relates to an architecture for a3-dimensional memory array that allows formation of minimum orsub-minimum pitch vertical conductors without requiring etches involvinghigh aspect-ratios.

2. Discussion of the Related Art

In high density 3-dimensional memory structures, such as those disclosedin the Non-Provisional applications or the Provisional Applications, itis desirable to make the memory cells as small as possible—therebyincreasing the memory cell density—while maintaining a highmanufacturing yield. As the size of each memory cell diminishes, theaspect ratio of a feature (e.g., the depth of a trench divided by itshorizontal etched gap dimension) increases. In the example of a trench,with the total thickness of the layers etched kept constant, the trenchaspect ratio increases as the feature size decreases. An alternativemethod to increase the memory cell density is to provide more layers ofmemory cells in the vertical direction. Without changing the etchprocess, this alternative method necessarily increases the trench aspectratio. In the current state of the art, when the trench aspect ratioexceeds approximately 50, etching of the trench becomes unreliablydifficult or prohibitively costly.

SUMMARY

The present invention provides a method for fabricating a memorystructure with minute feature sizes (e.g., 20 nm or less, at thestate-of-the art), or with 8 or more layers of memory cells in thememory structure. The present invention also provides an improvedisolation between adjacent memory cells along the same and oppositesides of an active strip in the memory structure. The improved isolationis provided by introducing a strong dielectric barrier film betweenadjacent memory cells along the same side of an active strip, and bystaggering memory cells of opposite sides of the active strip. (In thisdetailed description, the term “active strip” refers to the portion of ahorizontal, elongated memory structure that forms the channel regionsand the common source and drain regions of a string of memory cells.)

According to another embodiment of the present invention, an improvedisolation between adjacent memory cells along the same and oppositesides of a local word line stack in a vertical NOR-string type memorystructure with horizontal local word lines. The improved isolation isprovided by introducing a strong dielectric barrier film betweenadjacent memory cells along the same side of a local word line, and bystaggering memory cells of opposite sides of the local word line.

The present invention is better understood upon consideration of thedetailed description below, in conjunction with the accompanyingdrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows an initial step of forming global interconnect conductors10 for 3-dimensional NOR-type memory array 50 (not shown), after supportcircuitry for the memory array (e.g., sense amplifier, address decoders,input and output circuitry) has been formed in semiconductor substrate 5(not expressly shown), in accordance with one embodiment of the presentinvention.

FIG. 2 illustrates active stacks formed at an intermediate step in thefabrication of 3-Dimensioanl NOR-type memory array 50; active stack 100consists of eight active strips, including active strip 255 which ismagnified on the left for greater clarity.

FIG. 3 shows memory structure 50 of FIG. 2, after charge trappingmaterial 240 and P⁺ semiconductor layer 250 have been deposited andprocessed, in accordance with one embodiment of the present invention.

FIG. 4 shows memory structure 50 of FIG. 3, after charge trappingmaterial 240 and P+ semiconductor layer 250 are patterned and etched,thereby forming a first group of the memory cells in 3-DimensioanlNOR-type memory array 50, with P⁺ semiconductor layer 250 providing afirst set of vertical local word line conductors 275.

FIG. 5 shows memory structure 50 of FIG. 4, after second charge-trappinglayer 270 is conformally deposited onto the side walls of trenches 295between adjacent local word lines 275 of memory structure 50 of FIG. 4,followed by deposition of a second layer of P⁺ semiconductor material,which forms second group of local word line conductors 280, inaccordance with one embodiment of the present invention.

FIG. 6 shows memory structure 50 of FIG. 5, after a second set of globalword lines (labeled global word lines 290) and corresponding vias (e.g.,vias 300) are formed above the memory structure to connect to local wordlines 280, in accordance with one embodiment of the present invention.

FIGS. 7A and 7B show memory structure 50, according to a secondembodiment of the present invention, in which a first group of localword lines and a second group of local word lines are formedsuccessively, both groups of word lines being substantially the same inmaterials and dimensions.

To facilitate cross-referencing among the figures, like elements areassigned like reference numerals.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention improves memory cell density in memory structures(e.g., 3-Dimensional NOR-type memory arrays) and their manufacturingprocesses, such as those already disclosed in the Non-Provisionalapplications and the Provisional Applications incorporated by referenceabove. The present invention improves, for example, the 3-dimensionalNOR-type memory arrays, and the manufacturing processes thereof, thatare disclosed in Non-Provisional application III, in conjunction withFIGS. 46-54 therein.

FIG. 1 shows an initial step of forming 3-dimensional NOR-type memoryarray 50, after support circuitry for the memory array (e.g., senseamplifier, address decoders, input and output circuitry) has been formedin semiconductor substrate 5 (not shown expressly), in accordance withone embodiment of the present invention. As shown in FIG. 1, over thesemiconductor substrate 5 is formed inter-layer dielectric (ILD) layer25. A set of conductors (e.g., conductors 10), mutually electricallyisolated from each other, are then formed over ILD layer 25. Asconductors 10 are intended for connecting the local word lines of thememory cells in 3-dimensional NOR-type memory array 50 being formed,conductors 10 are referred herein as “global word lines” 10. (Of course,where appropriate, in addition to providing connection to the local wordlines of the memory cells, conductors 10 may also serve generally asinterconnect conductors for memory structure 50.). Global word lines 10are each connected to the appropriate circuitry in semiconductorsubstrate 5 by vias or buried contacts, such that appropriate voltagesfor memory cell operations (e.g., programming, erase, program-inhibit,read) may be supplied from the circuitry in semiconductor substrate 5.Global word lines 10 may be fabricated using any suitable technique,e.g., a subtractive metal process or a damascene metal process, using aconductive material, such as one or more layers of metal (e.g.,Ti/TiN/W) or P⁺ polysilicon.

Thereafter, a next ILD layer 233 (not shown) is formed covering globalword lines 10. Thereafter, vias 20 through ILD layer 233 are formed(e.g., by etching and conductor deposition in ILD layer 233), forexample, in a conventional manner. Vias 20 are provided to connect localword lines in 3-D NOR memory array 50 being formed to global word lines10. Vias 20 may be formed out of the same conductive material as globalword lines 10 (i.e., one or more layers of metal (e.g., Ti/TiN/W) or P⁺polysilicon). Any excess conductive material may be removed from the topsurface of ILD layer 233 by any suitable method (e.g., CMP), leavingonly the conductive material in the etched vias.

FIG. 2 shows an intermediate step in the formation of 3-D NOR-typememory array 50, after a number of active stacks (e.g., active stack100) have been formed. The active stacks are formed by etching deeptrenches 235 into the layers of semiconductor and insulating materialsthat are consecutively deposited over ILD layer 233 of FIG. 1, usingsuch manufacturing processes as those discussed in the Non-provisionalapplication I, in conjunction with its FIGS. 5a-5h -3 and theiraccompanying descriptions. In FIG. 2, the active stacks are illustratedby representative active stack 100, with representative active strip 255in active stack 100 being magnified on the left for greater clarity.

As shown in FIG. 2, active strip 255 includes N⁺ semiconductor layers130 and 140 (e.g., silicon or polysilicon), which are provided adjacentmetal layers 110 and 120, respectively, provided to reduce resistance inN⁺ semiconductor layers 130 and 140. Dielectric cladding layers 150,160, 170, and 180 are provided to electrically insulate metal layers 110and 120, so as to prevent any unintended short circuit. N⁺ semiconductorlayers 130 and 140, together with their respective metal layers 110 and120, form a common source sublayer and a common drain sublayer in thestring of memory cells being formed along active strip 255. Between N⁺semiconductor layers 130 and 140 are formed channel semiconductor layers190 and 200 on opposite sides of active strip 255. In this embodiment,channel semiconductor layers 190 and 200 are formed by filling cavitiesresulting from a partial removal of a sacrificial layer (“SAC1”). Infact, the remaining SAC1 layer is shown in FIG. 2 as SAC1 layer 210,between channel semiconductor layers 190 and 200. (In an alternativeembodiment, SAC1 layer 210 may be completely removed subsequently, so asto result in an air or vacuum gap in the space where SAC1 layer 210 isnow shown; alternatively, channel layers 190 and 200 can be allowed tomerge together to fill the space previously occupied by SAC1 layer.)

Adjacent active strips in active stack 100 are insulated from each otherby a dielectric layer, as illustrated in FIG. 2 by representativedielectric layer 220. In addition, hard mask layer 230 is providedbefore trenches 235 between the active stacks are etched. Hard masklayer 230 stabilizes the subsequent active stacks that are formed by theetching. The use of such hard mask layer 230, and further including theuse of struts (not shown in FIG. 2), to stabilize high aspect ratiostructures, are disclosed in Non-provisional applications III. In thisexample, each active strip may have a width of 15 nm to 50 nm (along the3^(rd) direction, indicated in FIG. 2), and each layer of hard mask 230may support formation of 8 or more active strips one on top of anotherin each active stack. As disclosed in Non-provisional application V, theNOR-type memory array may be built up in “segmented stacks” (i.e.,forming stacks of 8 layers of active strips at a time). Using thesegmented stacks approach, the manufacturing process steps may berepeated numerous times to form a memory array with 16-, 24-, 32-, 48-,64- . . . layers of active strips.

In one embodiment, N⁺ semiconductor layers 130 and 140, metal layers 110and 120, channel semiconductor layers 190 and 200, and dielectric layer220 may each be about 180 nm thick, such that the 8 active strips inactive stack 100, together with the 50-nm hard mask layer 230, rise to atotal height of 1490 nm or higher. With 45 nm wide local word lines 275and a 45 nm gap or trench between adjacent local word lines, the aspectratio of the etched trench is 33:1. If active stack 100 has 12 layers ofactive strips, the trench aspect ratio reaches 49:1.

Thereafter, over the side walls and bottom of each trench betweenadjacent active stacks is provided conformally charge-trapping layer 240(see, e.g., FIG. 3, at inset), which may be a SiO₂—SiN—SiO₂ triple-layer(i.e., an oxide-nitride-oxide or “ONO” layer). The charge trappingfunction of an ONO layer is known to those of ordinary skill in the art.Charge-trapping layer 240 may consist of, for example, from less than 3nm to 6 nm of SiO₂ (or a bandgap-engineered dielectric sandwich), 6 nmof SiN and 6 nm of SiO₂ (or a dielectric film with a high dielectricconstant, such as a Al₂O₃ film). After charge-trapping layer 240 isdeposited, a 3-nm thick protective polysilicon layer may also beconformally deposited. The portions of charge-trapping layer 240 and theprotective polysilicon layer at the bottom of each trench may then beremoved to expose vias 20, thereby allowing subsequent connectionsbetween global word lines 10 and the local word lines, which are next tobe formed. Even though the aspect ratio for this etch is greater than100, only the about 20 nm thick layer of charge-trapping layer 240 andprotective polysilicon layer 250 at the bottom of each trench isremoved. Following this etch, P⁺ semiconductor layer 250 (e.g., siliconor polysilicon), is deposited to fill the remaining exposed trenches235. FIG. 3 shows memory structure 50 of FIG. 2, after charge trappingmaterial 240 and P⁺ semiconductor layer 250 have been deposited andprocessed, in accordance with one embodiment of the present invention.P⁺ semiconductor layer 250 may be replaced by a metallic conductor(e.g., titanium nitride, titanium, tantalum nitride, tantalum, tungstennitride, tungsten or another refractive metal having a suitable metalwork function relative to SiO₂).

Charge-trapping layer 240, consisting of a ONO triple-layer (shown as,e.g., tunnel oxide 242, storage nitride 244, blocking oxide 246 in FIG.4), may be approximately 15 nm thick (as measured along the 3^(rd)direction). Charge-trapping layer 240 and P⁺ semiconductor layer 250 arethen patterned and etched (including removal of any residual of the ONOtriple-layer in the spaces not protected by local word lines 275) toform a first group of the memory cells in the 3-Dimensional NOR-typememory array, with post-etch P⁺ semiconductor layer 275 providing afirst set of vertical local word lines, as shown in FIG. 4. Theresulting separations between adjacent local word lines 275 of the firstgroup (indicated in FIG. 4 as shafts 295) allow a second group ofvertical local word lines 280 to be formed therein, with theirassociated charge-trapping layers 270 (see FIG. 5). In the currentexample, the width of each shaft (along the 2^(nd) direction) may beapproximately 75 nm (i.e., the 45-nm width of a local word line plus the15 nm thickness of ONO triple-layers 270 on each side of local word line280). The aspect ratio to etch a trench of 75 nm wide is approximately1490/75=20:1, which is considerably more relaxed compared to theprevious 33:1, without the structures of FIGS. 4 and 5. Yet, the localword line pitch (i.e., the line width plus line-to-line spacing) isreduced from the standard pitch of (45+45)=90 nm to (45+45+(2*15))/2=60nm, which is a one-third reduction of a standard pitch. Although localword lines 275 along opposite sides of each active stack are shown inFIGS. 4 and 5 aligned in the horizontal direction transverse to thelength of the active strip (i.e., along the 3^(rd) direction), they mayalso be provided in a staggered fashion, such as taught inNon-provisional application IV. In the staggered configuration, adjacentmemory cells that are on opposite sides of an active strip are situatedfurther apart to reduce parasitic program disturb.

After etching shafts 295 between adjacent ones of the first group oflocal word lines, a second deposition of a charge-trapping material(e.g., charge-trapping layer 270 of FIG. 5, which may be an ONOtriple-layer, including the layers labeled 272, 274 and 276) isconformally deposited onto the side walls of each of shafts 295 next toeach of first group of local word lines 275. Following formation ofcharge-trapping layer 270, a second layer of P⁺ semiconductor materialis deposited to form the second group of local word lines (labeled localword lines 280 in FIG. 5). Portions of charge-trapping layer 270 andlocal word lines 280 are then removed from the top of the memorystructure, thereby completing the second group of the memory cells. Theresulting structure is shown in magnified area Ai of FIG. 5, whichclearly shows word lines alternating from the first group (i.e., wordlines 275) and the second group (i.e., word lines 280), each separatedfrom another by the thickness of the ONO charge-trapping layer 270

Prior to deposition of the second P⁺ semiconductor layer in advance offorming local word lines 280, the portion of charge-trapping layer 270at the bottom of the trench may be removed by anisotropic etch to exposevias 20 underneath the memory structure to connect word lines 280 toglobal word lines 10 (see, global word lines 10 of FIG. 1). However, asdiscussed below, if a second set of global word lines (e.g., global wordlines 290 of FIG. 6) is provided above the memory structure, the portionof charge-trapping layer 270 at the bottom of the trenches need not beremoved. A higher density memory structure can be realized by providingglobal word lines both on top of and beneath memory structure 50. Asshown in FIG. 6, global word lines 290 from the top may use vias 300 tocontact the local word lines on one side of an active strip while theglobal word lines beneath memory structure 50 may use vias 20 to contactthe local word lines on the opposite side of the active strip.Alternatively, both the first group (i.e., local word lines 275) and thesecond group (i.e., local word lines 280) can be contacted by globalword lines from the top (i.e., conductors 290), or both can be contactedfrom the bottom (i.e., conductors 10) through appropriately etched vias.Of course, where appropriate, global word lines 290 may also servegenerally as interconnect conductors for memory structure 50, inaddition to providing connections to local word lines 280.

Depositing charge-trapping layers 240 and 270 in two successivedepositions has the important positive effect that the charge-trappinglayers of the first and second groups are separate ONO triple-layers.FIG. 5 shows a discontinuity between the ONO triple-layer associatedwith the first group of local word lines (i.e., layers 242, 244 and 246)and the ONO triple-layer associated with the second group of local wordlines (i.e., layers 272, 274, and 276). This discontinuity provides astrong dielectric barrier film (such as provided by blocking oxide layer272), thereby substantially eliminating the undesirable lateralconduction of charge trapped between adjacent memory cells (i.e.,between charge trapped silicon nitride layers 244, associated with thefirst group of local word lines, and silicon nitride layer 274,associated with the second group of local word lines).

Although charge-trapping layers 240 and 270 are normally deposited toreplicate as closely as possible their electrical characteristics, insome embodiments of the present invention charge-trapping layer 240 andcharge-trapping layer 270 may be deposited with distinctly differentelectrical characteristics. For example, charge-trapping layer 240 maybe optimized to have maximum long-term data retention, whilecharge-trapping layer 270 may be separately optimized to provide fasterprogram/erase/read operations. In that arrangement, memory cellsassociated with charge-trapping layer 270 may be used as cache memorywith higher write/erase cycle endurance characteristics (at the cost ofa shorter data-retention time). In some embodiments of the currentinvention the first and second groups of memory cells need not eachencompass half of the total number of memory cells in the memorystructure.

A second embodiment of the present inventions is illustrated in FIGS. 7Aand 7B. In this second embodiment, rather than local word lines 275 andtheir associated charge-trapping layers 240 (see, e.g., FIG. 4), localword lines 280 and their associated charge-trapping layers 270 are usedthroughout, so that both the first and the second groups of local wordlines have substantially the same structures, such as the structure ofthe second group of local word lines described above.

According to this second embodiment, after forming the active stacks(e.g., active stack 100), as shown in FIG. 2, trenches 235 are filled bydepositing a sacrificial material (e.g., a fast-etching dielectricmaterial, such as porous SiO₂). This sacrificial material is thenpatterned and partially etched to form islands 400 of sacrificialmaterial, as indicated by reference number 400 in FIG. 7A, at inset).Each island is separated from each of its neighbors by a shaft (which isshown in FIG. 7A filled in by charge-trapping layer 270 and local wordline 280, as discussed next). Each of islands 400 has a predeterminedlength along the second direction, which is substantially the same asthe separation between adjacent ones of islands 400 in each of trenches235. This separation is sufficient to accommodate the width of a localword line (e.g., the width of one of local word lines 280 of FIG. 5)plus double the thickness of a charge-trapping layer (e.g.,charge-trapping layer 270 of FIG. 5), to accommodate charge-trappinglayers on both sides of the local word line along the second direction.

Next, a charge-trapping layer is deposited conformally over the sidewalls and the bottoms of the shafts created in forming islands 400,leaving a void within each shaft, which may then be filled by aconductive material. This charge-trapping layer may be providedsubstantially by the same material of charge-trapping layer 270 of FIG.5 (e.g., an oxide-nitride-oxide triple-layer with the constituent layers272, 274 and 276, respectively). To simplify reference, thischarge-trapping layer is labeled 270 in FIG. 7A as well. Similarly, theconductive material filling the void in each shaft may be provided bythe same conductive material that forms local word lines 280 of FIG. 5.Again, to simplify reference, this conductive material, which forms aset of conductive columns each surrounded by charge-trapping layer 270;the conductive columns are also referred to as local word lines 280. Theconductive material may be selected from a group that includes titanium,titanium nitride, tantalum nitride, tantalum, tungsten nitride,tungsten, cobalt, a heavily-doped P⁺ or N⁺ polysilicon, or anotherrefractive metal. The conductive material is then removed from the topsurface of the active stacks by CMP or controlled etching.

Conductive columns 280 and their surrounded charge-trapping layer 270 ofFIG. 7A are then masked to protect them from the next etching step,which removes islands 400, thereby creating a second set of shafts.(Conductive columns 280 and its surrounding charge-trapping layers 270are hereinafter referred to as “the first group of local word lines” and“the first charge-trapping layers,” respectively.) A secondcharge-trapping layer is then deposited conformally over the side wallsand the bottoms of each of this second set of shafts, leaving a void atthe center, which is filled by a column of conductive material, thusforming a second group of local word lines and second charge-trappinglayers, respectively. (This second group of local word lines and theirsurrounding second charge-trapping layers may be provided by the samematerials as the first group of local word lines and the first chargelayers, respectively.) The substantially identical word lines,alternating between a local word line from the first group and a localword line from the second group of local word lines are shown in FIG.7B. The remaining process steps to connect the first and second groupsof local word lines to global word lines 10 (i.e., the set of globalword lines beneath the memory structure; see, e.g., FIG. 1) and globalword lines 290 (i.e., the set of global word lines above the memorystructure; see, e.g., FIG. 6) follow the corresponding steps describedabove for the first embodiment.

Both the first embodiment (FIG. 5) and the second embodiment (FIG. 7B)enjoy the same, more favorable etch aspect ratios than the prior art.Both embodiments enjoy favorable physical separation between adjacentlocal word lines. Although these area-per-cell metrics for bothembodiments are smaller than that of the prior art, the area-per-cellmetric for the second embodiment is larger than the area-per-cell metricfor the first embodiment, as the separation between adjacent local wordlines for the second embodiment includes two back-to-backcharge-trapping layers (e.g. 2 times 15 nm, in one example), while thecorresponding separation in the first embodiment includes only a singlesuch charge-trapping layer (i.e. 15 nm in the same example). The secondembodiment, however, has certain compensating advantages over the firstembodiment. First, adjacent local word lines and their associatedcharge-trapping layers in the second embodiment are substantiallyidentical in construction, so that physical characteristics of adjacentlocal word lines can better-track each other. Second, the firstembodiment requires etching of conductive material 275 all the way downthe depth of its trench, which can be challenging when conductivematerial 275 includes a refractive metal. The first embodiment alsorequires etching clear charge-trapping layers 242, 244 and 246 along theside walls of the trench in the area where conductive material 275 hasbeen removed. These etching steps are not required for defining thefirst and second groups of word lines in the second embodiment, as thewidth of a column in each of the groups of word lines in the secondembodiment is predetermined by the length of the islands and thethicknesses of the charge-trapping layers.

Although the two-step formation of the local word lines of the presentinvention requires a greater number of process steps as compared toprocesses discussed in the Non-Provisional applications and theProvisional Applications, the present invention provides areduced-silicon area memory array which, from a cost point of view, canmore than compensate the additional required process steps.

The present invention allows formation of multi-layer active stacks thatare several microns high, requiring low-resistivity conductors forconnecting between the memory cells and the global word lines at the topof the active stacks and logic circuitry in the substrate below theactive stacks. As the first or second groups of local word lines of thepresent invention run along the vertical direction perpendicular toplanar surface of the substrate, these local word lines may be adaptedto serve more generally as tall interconnects between one or moreconductive layers running above the active stacks and one or moreconductive layers running between the bottom of the active stacks andthe substrate.

The tall interconnects may be formed in the trenches between activestrips within the memory array, within dummy active stacks, or within atall insulating layer (e.g., sacrificial dielectric material 400 of FIG.7A) that is formed adjacent to the active stacks and given substantiallythe same height as the active stacks. The dummy active stacks do notthemselves serve an electrical purpose, serving merely as an isolationmedium to support the tall interconnects, which are patterned as amatrix of closely-spaced rows and columns of via openings (i.e., deepholes that are etched through to the bottom of the dummy active stacks).In the second embodiment, the via opening may be etched, for example,concurrently with etching the second set of trenches, so that the firstcharge-trapping layer (e.g., an ONO triple-layer) may be deposited onthe sidewalls of the via openings conformally as a wall insulator. Thedeposited first charge-trapping layer at the bottom of the via holes,together with the isolation dielectric layer therebelow, may be maskedand removed by an anisotropic etch to expose any required contact viasunderneath for subsequent electrical connection.

The via holes may then be filled with a conductive material (e.g.,titanium, titanium nitride, tantalum nitride, tantalum, tungstennitride, tungsten, cobalt or another metallic conductor, such as arefractive metal or a silicide). The excess conductive material on thetop surface of the active stacks may be removed by CMP or by acontrolled etch (when a damascene-like process is used to isolateindividual conductors). An isolation dielectric layer is then depositedon the top surface and vias through this isolation dielectric layer maybe patterned and etched to expose the conductive material in the filledvia holes underneath where a top-to-bottom conductor path is required.

As a further improvement, the charge-trapping layer surrounding eachtall interconnect can be employed to mechanically support and protectthe conductive material of the tall interconnect, allowing thesacrificial dielectric material between the interconnects to be removedto create air-gap isolation, thereby significantly reducing theparasitic capacitive coupling between adjacent tall interconnects.Removing the sacrificial dielectric material without etching thecharge-trapping layer may be achieved when an etchant is available thathas different etch selectivity between the sacrificial dielectricmaterial and the charge-trapping layer. For example, when thesacrificial dielectric material is a porous silicon oxide and thecharge-trapping layer includes a silicon nitride, HF may be a suitablechemical etchant, as it removes the sacrificial oxide while leavingessentially intact the silicon nitride. In this manner, even when a tallinterconnect leans toward an adjacent tall interconnect, the tallinterconnects are electrically insulated from each other by theirrespective charge-trapping layer acting as cladding.

Providing successive groups of side-by-side local word lines (hence,successive groups of thin-film storage transistors) may also beapplicable to three-dimensional vertical thin film transistor memorystrings, such as those discussed in related Non-Provisional applicationII. For example, FIGS. 6a and 6b of Non-Provisional application II eachdisclose vertical NOR strings of thin-film storage transistors (e.g.,the vertical NOR string having N⁺ polysilicon 654 as a common local bitline, P⁻ polysilicon layer 656 as left and right common channels, and N⁺polysilicon 655 as a common local source line). Such vertical NORstrings may be formed in successive operations according to the presentinvention. First, every alternate row of vertical NOR strings may beformed in a first set of trenches (e.g., the trench between adjacentword lines 623 p-R and 623 p-L). Then, the other alternate rows of thevertical NOR strings are then formed in the spaces between rows of thevertical NOR strings that have been formed. The charge-trapping layersassociated with the first and second groups of vertical NOR strings neednot be the same. In that manner, the different groups of vertical NORstrings may have distinctly different storage characteristics.

The above detailed description is provided to illustrate specificembodiments of the present invention and is not intended to be limiting.Numerous variations and modifications of within the scope of the presentinvention are possible. The present invention is set forth in theaccompanying claims.

We claim:
 1. A process for forming a memory structure, comprising:forming first and second multi-layer semiconductor structures above aplanar surface of a semiconductor substrate separated from each other bya trench with a depth along a first direction substantiallyperpendicular to the planar surface, the trench having a predeterminedwidth along a second direction substantially parallel the planarsurface; forming in the trench a first group of conductors extendingalong the first direction, each conductor comprising a first conductivematerial and each conductor being isolated from each adjacentmulti-layer semiconductor structure by a first charge-trapping material,wherein the conductors within each trench are separated from each otherby a predetermined distance; and forming a second group of conductorsextending along the first direction, each conductor in the second groupof conductors being provided between two adjacent ones of the firstgroup of conductors, each conductor of the second group of conductorscomprising a second conductive material and each conductor in the secondgroup of conductors being isolated from its adjacent multi-layersemiconductor structure by a second charge-trapping material; whereineach conductor in the first or the second group of conductors and aportion of the first or second charge-trapping material between thatconductor one of the multi-layer semiconductor structure form a gateelectrode and a storage layer for a thin-film storage transistor.
 2. Theprocess of claim 1 wherein, for a plurality of storage transistors inone of the multi-layer semiconductor structures, the multi-layersemiconductor structure provides a common source region and a commondrain region.
 3. The process of claim 1, wherein forming the first groupof conductors comprises: forming a layer of the first charge-trappingmaterial conformally over the side walls of the trench, leaving a spaceenclosed by the layer of the charge-trapping material in the trench;filling the space using the first conductive material; patterning andetching the first conductive material in the space to form the firstgroup of conductors, such that adjacent ones of the first group ofconductors are separated along the second direction by the predetermineddistance.
 4. The process of claim 3, wherein forming the second group ofconductors comprises: removing the layer of first charge-trappingmaterial within the predetermined distance separating each adjacent pairof the first group of conductors; forming a layer of the secondcharge-trapping material conformally over exposed sidewalls of the firstgroup of conductors, leaving a space surrounded by the layer of secondcharge-trapping material between adjacent ones of the first group ofconductors; and filling the space surrounded by the layer of secondcharge-trapping material with the second conductive material to form thesecond group of conductors.
 5. The process of claim 1, wherein formingthe first group of conductors comprises: depositing a sacrificialmaterial to fill the trench; patterning and etching the sacrificialmaterial to form a first set of shafts, each shaft being separated by aremaining portion of the sacrificial material; forming a layer of thefirst charge-trapping material conformally over the sidewalls of theshafts, leaving a space surrounded by the layer of the firstcharge-trapping material within each shaft; and filling the spacesurrounded by the layer of the first charge-trapping material in eachshaft with the first conductive material to form the first group ofconductors.
 6. The process of claim 5, wherein forming the second groupof conductors comprises: removing the remaining portions of thesacrificial material to form a second set of shafts; forming a layer ofthe second charge-trapping material conformally over the sidewalls ofthe second set of shafts, leaving a space surrounded by the layer of thesecond charge-trapping material within each of the second set of shafts;and filling the space surrounded by the layer of the secondcharge-trapping material in each of the second set of shafts with thesecond conductive material to form the second group of conductors. 7.The process of claim 1, wherein at least one the first and secondconductive materials is a metallic conductor.
 8. The process of claim 1,wherein at least one the first and second conductive materials comprisea refractory metal.
 9. The process of claim 1, wherein at least one thefirst and second conductive materials is selected from a groupconsisting of titanium, titanium nitride, tantalum nitride, tantalum,tungsten nitride, tungsten, cobalt, heavily-doped p⁺ polysilicon,heavily-doped n⁺ polysilicon, and silicides.
 10. The process of claim 1,wherein at least one of the first and second charge-trapping layerscomprises an oxide-nitride-oxide triple-layer.
 11. The process of claim1, wherein the conductors formed on opposite sides of each multi-layersemiconductor structure along a line along a third direction belong todifferent ones of the first and second groups of conductors, and whereinthe third direction is substantially perpendicular to both the first andsecond directions.
 12. The process of claim 1, wherein firstcharge-trapping material and the second charge-trapping material havesubstantially the same charge-trapping characteristics.
 13. The processof claim 1, wherein the first charge-trapping material and the secondcharge-trapping material have substantially different charge-trappingcharacteristics.
 14. The process of claim 1, further comprising forminga first system of global interconnect conductors in an insulation layerbetween the memory structure and the planar surface of the semiconductorsubstrate and wherein the process further comprises removing portions ofinsulation layer and, adjacent to the insulation layer, either the firstcharge-trapping layer, the second charge-trapping layer, or both, toexpose the corresponding portions of global interconnect conductors, toallow connections to the first group of conductors, the second group ofconductors, or both.
 15. The process of claim 14, further comprisingforming a second system of global connectors above the memory structure,such that the connections allow the first system of global interconnectconductors to be electrically interconnected to the second system of theglobal interconnect conductors.
 16. The process of claim 15, wherein atleast a portion of the second system of global interconnect conductorsare electrically connected to circuitry formed in the semiconductorsubstrate.
 17. The process of claim 1, wherein selected conductors inthe first and the second group of conductors are each provided a lowerresistivity by virtue of its length along the second direction than anyof the conductors—other than the selected conductors—in the first andthe second groups of conductors.
 18. The process of claim 17, whereineach of the selected conductors is part of a via interconnect, a portionof a pre-charge thin-film transistor, a decode selecting thin-filmtransistor, or another thin-film transistor used for a non-storagepurpose.
 19. The process of claim 1, wherein the first group ofconductors each have a first predetermined width along the seconddirection, the second group of conductors each have a secondpredetermined width along the second direction, and the secondcharge-trapping layer has a third predetermined width along the seconddirection, wherein the first predetermined width is less than twice thethird predetermined width plus the second predetermined width.
 20. Theprocess of claim 1, wherein each conductor in the first group ofconductors is electrically insulated from at least one conductor in thesecond group of conductors by the second charge-trapping layer.
 21. Theprocess of claim 1, further comprising providing a hard-mask materialabove the multi-layer semiconductor structures for protection during anyetching steps carried out during forming the first group of conductorsor forming the second group of conductors.
 22. A memory structure,comprising: first and second multi-layer semiconductor structures abovea planar surface of a semiconductor substrate separated from each otherby a trench with a depth along a first direction substantiallyperpendicular to the planar surface, the trench having a predeterminedwidth along a second direction substantially parallel the planarsurface; a first group of conductors in the trench extending along thefirst direction, each conductor comprising a first conductive materialand each conductor being isolated from each adjacent multi-layersemiconductor structure by a first charge-trapping material, wherein theconductors within each trench are separated from each other by apredetermined distance; and a second group of conductors extending alongthe first direction, each conductor in the second group of conductorsbeing provided between two adjacent ones of the first group ofconductors, each conductor of the second group of conductors comprisinga second conductive material and each conductor in the second group ofconductors being isolated from its adjacent multi-layer semiconductorstructure by a second charge-trapping material; wherein each conductorin the first or the second group of conductors and a portion of thefirst or second charge-trapping material between that conductor one ofthe multi-layer semiconductor structure form a gate electrode and astorage layer for a thin-film storage transistor.
 23. The memorystructure of claim 22 wherein, for a plurality of storage transistors inone of the multi-layer semiconductor structures, the multi-layersemiconductor structure provides a common source region and a commondrain region.
 24. The memory structure of claim 22, wherein eachconductor in the first group of conductors is immediately adjacent aportion of a layer of the second charge-trapping material that isadjacent to a conductor in the second group of conductors.
 25. Thememory structure of claim 24, wherein the conductor in the second groupof conductors is surrounded by a layer of the second charge-trappingmaterial.
 26. The memory structure of claim 22, wherein the first groupof conductors each comprise a conductor surrounded by a layer of thefirst charge-trapping material.
 27. The memory structure of claim 26,wherein the second group of conductors each comprise a conductorsurrounded by a layer of the second charge-trapping material.
 28. Thememory structure of claim 22, wherein at least one the first and secondconductive materials is a metallic conductor.
 29. The memory structureof claim 22, wherein at least one the first and second conductivematerials comprise a refractory metal.
 30. The memory structure of claim22, wherein at least one the first and second conductive materials isselected from a group consisting of titanium, titanium nitride, tantalumnitride, tantalum, tungsten nitride, tungsten, cobalt, heavily-doped p⁺polysilicon, heavily-doped n⁺ polysilicon, and silicides.
 31. The memorystructure of claim 22, wherein at least one of the first and secondcharge-trapping layers comprises an oxide-nitride-oxide triple-layer.32. The memory structure of claim 22, wherein the conductors formed onopposite sides of each active stack along a line extending along thethird direction belong to different ones of the first and second groupsof conductors.
 33. The memory structure of claim 22, wherein the firstcharge-trapping material and the second charge-trapping material havesubstantially the same charge-trapping characteristics.
 34. The memorystructure of claim 22, wherein the first charge-trapping material andthe second charge-trapping material have substantially differentcharge-trapping characteristics.
 35. The memory structure of claim 22,further comprising a first system of global interconnect conductors inan insulation layer between the memory structure and the planar surfaceof the semiconductor substrate and wherein portions of insulation layerand, adjacent the insulation layer, either the first charge-trappinglayer, the second charge-trapping layer, or both, are removed to exposethe corresponding portions of global interconnect conductors, to allowconnections to the first group of conductors, the second group ofconductors, or both.
 36. The memory structure of claim 35, furthercomprising a second system of global connectors above the memorystructure, such that the connections allow the first system of globalinterconnect conductors to be electrically interconnected to the secondsystem of the global interconnect conductors.
 37. The memory structureof claim 36, wherein at least a portion of the second system of globalinterconnect conductors are electrically connected to circuitry formedin the semiconductor substrate.
 38. The memory structure of claim 22,wherein selected conductors in the first and the second group ofconductors are each provided a lower resistivity by virtue of its lengthalong the second direction than any of the conductors—other than theselected conductors—in the first and the second groups of conductors.39. The memory structure of claim 38, wherein each of the selectedconductors is part of a via interconnect, a portion of a pre-chargethin-film transistor, a decode selecting thin-film transistor, oranother thin-film transistor used for a non-storage purpose.
 40. Thememory structure of claim 22, wherein the first group of conductors eachhave a first predetermined width along the second direction, the secondgroup of conductors each have a second predetermined width along thesecond direction, and the second charge-trapping layer has a thirdpredetermined width along the second direction, wherein the firstpredetermined width is less than twice the third predetermined widthplus the second predetermined width.
 41. The memory structure of claim22, wherein each conductor in the first group of conductors iselectrically insulated from at least one conductor in the second groupof conductors by the second charge-trapping layer.
 42. The memorystructure of claim 22, further comprising a hard-mask material providedabove the active stacks for protection during any etching steps carriedout during forming the first group of conductors or forming the secondgroup of conductors.